5.5 electrolytic capacitor Can not touch heating elements, high-power resistors, resistor-min, pressure, heat and so on. Capacitance solution with a minimum interval of the radiator to 10.0MM, its components to the heat sink for the smallest interval 2.0MM.
5.6 million large-scale Devices (such as: transformer with a diameter of more than 15.0MM electrolytic capacitor, the high current socket, etc.) increase the area of copper and tin on the following chart; shaded area with the least fat pad area of the same.

5.7 screw hole within a radius of 5.0MM Copper can not have (outside the grounding request) components. (According to the requirements chart).
5.8 on the tin-screen printing can not have oil.
5.9 pad away from the center less than 2.5MM , Adjacent pad around the screen to have the oil package, stamp pad ink width 0.2MM (you 0.5MM).
5.10 jumper should not be placed below or motor IC, as well as other potential mass of metal components under.
5.11 in large areas of PCB design (about 500CM2 over and over) to prevent over tin plate bending furnace when the PCB, PCB board to stay in the middle of a 5 to 10MM wide gap holding components (alignment), used to have When combined with tin stove to prevent bending of the PCB board pressure, under the shadow of the district map::

A 5.12 per transistor to be marked on the screen in the e, c, b feet.
5.13 after the furnace need to have tin solder components, to be driven away tin plate, tin-off with the direction to the contrary, the degree depending on the size of the hole for 0.5MM to 1.0MM plans are as follows:

5.14 two-panel design When bearing in mind that the metal components, plug-in when the shell contact with the PCB, can not open the top of the pad, we must employ green oil or oil screen cover (for example, the crystal feet).
5.15 for the spot to reduce short-circuit, all the double-sided PCB , The hole had not opened the window green oil.
5.16 each on a PCB have been marked by solid arrow in the direction tin stove:

5.17 for the minimum distance between holes 1.25MM (two-panel invalid)

5.18 layout, DIP package IC The direction must be placed over the tin oven into a vertical direction, not parallel, the plans are as follows; if the layout of the difficulties can be allowed to place the level of IC (OP of IC packaging and DIP the opposite direction placed).

5.19 Wiring for horizontal or vertical direction from the vertical to go into the level of 45 degrees to enter.
5.20 components for the installation of horizontal or vertical.
5.21 screen characters for a 90-degree turn right or the level of display.
5.22 if the copper foil into a round pad than the width of the circular pad diameter of the hour, it would take to increase teardrop. Figure:

5.23 coding and design to be on the number of vacancies on the board.
5.24 have no connection to a reasonable place for grounding or power Use.
5.25 in the shortest possible route, with particular attention to the clock line, low line and all the high-frequency signal circuit wiring to be shorter.
5.26 analog circuits and digital circuits and power supply system ground to completely separate.
5.27 PCB if there are large areas of ground wire and power line area (an area more than 500 mm2), local open window. Figure:

5.28 electric plug-hole PCB's position as follows, the shadow of some of the components can not be released, except for hands components, L is the scope of the 50 330mm, H is the scope of the 50 250mm, fruit smaller than 50X50 puzzle will be open to Die 2723 play, if more than 330X250 board will be replaced by hand. Position to be in the long edge of the hole.

a door Beijing Institute of Computer Application (PCB Division)